SSTUP32866EC/G vs SSTUA32866EC/G,557 feature comparison

SSTUP32866EC/G Philips Semiconductors

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SSTUA32866EC/G,557 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description FBGA, BGA96,6X16,32 LFBGA, BGA96,6X16,32
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Logic IC Type BUS DRIVER D FLIP-FLOP
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 1
Part Package Code BGA
Pin Count 96
Manufacturer Package Code SOT-536-1
Family 32866
JESD-609 Code e1
Length 13.5 mm
Moisture Sensitivity Level 2
Number of Bits 14
Number of Functions 1
Output Characteristics OPEN-DRAIN
Output Polarity COMPLEMENTARY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 1.8 ns
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE
Width 5.5 mm
fmax-Min 450 MHz

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