SSTUP32866EC/G
vs
SSTUA32866EC/G,557
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
FBGA, BGA96,6X16,32
LFBGA, BGA96,6X16,32
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Number of Terminals
96
96
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
LFBGA
Package Equivalence Code
BGA96,6X16,32
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
96
Manufacturer Package Code
SOT-536-1
Family
32866
JESD-609 Code
e1
Length
13.5 mm
Moisture Sensitivity Level
2
Number of Bits
14
Number of Functions
1
Output Characteristics
OPEN-DRAIN
Output Polarity
COMPLEMENTARY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
1.8 ns
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
2 V
Supply Voltage-Min (Vsup)
1.7 V
Technology
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
Width
5.5 mm
fmax-Min
450 MHz
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