SSTUM32865ET/G,518
vs
IDT74SSTUBF32868ABKG8
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA,
|
FBGA,
|
| Pin Count |
160
|
176
|
| Manufacturer Package Code |
SOT802-2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
SSTU
|
SSTU
|
| JESD-30 Code |
R-PBGA-B160
|
R-PBGA-B176
|
| Length |
13 mm
|
15 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Bits |
28
|
28
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
160
|
176
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
FBGA
|
| Package Equivalence Code |
BGA160,12X18,25
|
BGA176,8X22,25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
1.4 ns
|
1.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.15 mm
|
|
| Supply Voltage-Max (Vsup) |
2 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
9 mm
|
6 mm
|
| fmax-Min |
450 MHz
|
410 MHz
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| JESD-609 Code |
|
e1
|
| Technology |
|
TTL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
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