SSTUH32866EC/G,518 vs PI74SSTUA32864NB feature comparison

SSTUH32866EC/G,518 NXP Semiconductors

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PI74SSTUA32864NB Diodes Incorporated

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS DIODES INC
Part Package Code BGA
Package Description LFBGA, LFBGA, BGA96,6X16,32
Pin Count 96
Manufacturer Package Code SOT536-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 2 3
Number of Bits 25 25
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.8 ns 2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.48 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 450 MHz 350 MHz
Base Number Matches 1 1
ECCN Code EAR99
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
JESD-609 Code e0
Package Equivalence Code BGA96,6X16,32
Terminal Finish TIN LEAD

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