Findchips: Compare SSTUH32865ET/G,518 vs SSTUH32865ET,551

SSTUH32865ET/G,518 vs SSTUH32865ET,551 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	9 X 13 MM, 0.80 MM HEIGHT, LEAD FREE, PLASTIC, SOT-802-1, TFBGA-160	TFBGA,
Pin Count	160	160
Manufacturer Package Code	SOT802-1	SOT802-1
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	SSTU	SSTU
JESD-30 Code	R-PBGA-B160	R-PBGA-B160
Length	13 mm	13 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	2
Number of Bits	28	28
Number of Functions	1	1
Number of Terminals	160	160
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Characteristics	OPEN-DRAIN	OPEN-DRAIN
Output Polarity	COMPLEMENTARY	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TFBGA	TFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Propagation Delay (tpd)	1.8 ns	1.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.2 mm	1.2 mm
Supply Voltage-Max (Vsup)	1.9 V	1.9 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	9 mm	9 mm
fmax-Min	450 MHz	450 MHz
Base Number Matches	1	1
	Logic » FF/Latches	Logic » FF/Latches