Findchips: Compare SSTUH32864EC,518 vs ICSSSTUA32866BHLFT

SSTUH32864EC,518 vs ICSSSTUA32866BHLFT feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	BGA	BGA
Package Description	LFBGA,	LFBGA,
Pin Count	96	96
Manufacturer Package Code	SOT536-1
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	SSTU	SSTU
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
Length	13.5 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	14	25
Number of Functions	1	1
Number of Terminals	96	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Characteristics	OPEN-DRAIN
Output Polarity	COMPLEMENTARY	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	1.8 ns	1.9 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.5 mm	1.5 mm
Supply Voltage-Max (Vsup)	1.9 V	1.9 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	5.5 mm
fmax-Min	450 MHz	410 MHz
Base Number Matches	1	1
Pbfree Code		Yes
Rohs Code		Yes
JESD-609 Code		e1
Moisture Sensitivity Level		3
Peak Reflow Temperature (Cel)		260
Terminal Finish		Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » FF/Latches	Logic » FF/Latches