SSTUB32866EC/G-T vs 74SSTUBF32865ABKG feature comparison

SSTUB32866EC/G-T NXP Semiconductors

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74SSTUBF32865ABKG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description LFBGA, LFBGA-160
Pin Count 96 160
Manufacturer Package Code SOT536-1 BKG160
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 32866 32865
JESD-30 Code R-PBGA-B96 R-PBGA-B160
Length 13.5 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 25 28
Number of Functions 1 1
Number of Terminals 96 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.5 ns 1.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.3 mm
Supply Voltage-Max (Vsup) 2 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 9 mm
fmax-Min 450 MHz 410 MHz
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
JESD-609 Code e1
Moisture Sensitivity Level 3
Package Equivalence Code BGA160,12X18,25
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER

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Compare 74SSTUBF32865ABKG with alternatives