Findchips: Compare SSTUB32866EC/G,518 vs SSTUA32866EC/G

SSTUB32866EC/G,518 vs SSTUA32866EC/G feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	LFBGA, BGA96,6X16,32	LFBGA, BGA96,6X16,32
Pin Count	96	96
Manufacturer Package Code	SOT536-1	SOT-536-1
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	32866	32866
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
Length	13.5 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	2	2
Number of Bits	25	14
Number of Functions	1	1
Number of Terminals	96	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Characteristics	OPEN-DRAIN	OPEN-DRAIN
Output Polarity	COMPLEMENTARY	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Equivalence Code	BGA96,6X16,32	BGA96,6X16,32
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	1.5 ns	1.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.5 mm	1.5 mm
Supply Voltage-Max (Vsup)	2 V	2 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	5.5 mm
fmax-Min	450 MHz	450 MHz
Base Number Matches	1	2
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » FF/Latches	Logic » FF/Latches