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SSTUA32S865ET,557 vs SSTUA32864EC/G,557 feature comparison

SSTUA32S865ET,557 NXP Semiconductors

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SSTUA32864EC/G,557 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description TFBGA, BGA160,12X18,25 LFBGA, BGA96,6X16,32
Pin Count 160 96
Manufacturer Package Code SOT802-2 SOT536-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B160 R-PBGA-B96
JESD-609 Code e0 e1
Length 13 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 28 25
Number of Functions 1 1
Number of Terminals 160 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA160,12X18,25 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.8 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 9 mm 5.5 mm
fmax-Min 450 MHz 450 MHz
Base Number Matches 1 1
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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Compare SSTUA32864EC/G,557 with alternatives