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SSTUA32S865ET,518 vs SSTUA32S865ET feature comparison

SSTUA32S865ET,518 NXP Semiconductors

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SSTUA32S865ET Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code BGA
Package Description TFBGA, FBGA, BGA160,12X18,25
Pin Count 160
Manufacturer Package Code SOT802-2
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU
JESD-30 Code R-PBGA-B160 R-PBGA-B160
Length 13 mm
Logic IC Type D FLIP-FLOP BUS DRIVER
Number of Bits 28
Number of Functions 1
Number of Terminals 160 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA160,12X18,25 BGA160,12X18,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Propagation Delay (tpd) 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE
Width 9 mm
fmax-Min 450 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Logic » FF/Latches
Logic » Other Logic ICs

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