SSTUA32866EC/G,557 vs IDT74SSTUBF32868ABKG8 feature comparison

SSTUA32866EC/G,557 NXP Semiconductors

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IDT74SSTUBF32868ABKG8 Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, BGA96,6X16,32 FBGA,
Pin Count 96 176
Manufacturer Package Code SOT-536-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 32866 SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B176
JESD-609 Code e1 e1
Length 13.5 mm 15 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 2 3
Number of Bits 14 28
Number of Functions 1 1
Number of Terminals 96 176
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA96,6X16,32 BGA176,8X22,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 1.8 ns 1.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 2 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 6 mm
fmax-Min 450 MHz 410 MHz
Base Number Matches 1 1
Pbfree Code Yes

Compare SSTUA32866EC/G,557 with alternatives

Compare IDT74SSTUBF32868ABKG8 with alternatives