Findchips: Compare SSTUA32864EC,518 vs SSTUA32864EC/G,557

SSTUA32864EC,518 vs SSTUA32864EC/G,557 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	LFBGA,	LFBGA, BGA96,6X16,32
Pin Count	96	96
Manufacturer Package Code	SOT536-1	SOT536-1
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	SSTU	SSTU
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
Length	13.5 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	25	25
Number of Functions	1	1
Number of Terminals	96	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	1.8 ns	1.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.5 mm	1.5 mm
Supply Voltage-Max (Vsup)	2 V	2 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	5.5 mm
fmax-Min	450 MHz	450 MHz
Base Number Matches	1	1
Rohs Code		Yes
JESD-609 Code		e1
Moisture Sensitivity Level		2
Package Equivalence Code		BGA96,6X16,32
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Technology		CMOS
Terminal Finish		Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » FF/Latches	Logic » FF/Latches