SSTU32865ET/G,518 vs SSTUG32865ET/S feature comparison

SSTU32865ET/G,518 NXP Semiconductors

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SSTUG32865ET/S NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description 9 X 13 MM, 0.80 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, SOT-802-1, TFBGA-160 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160
Pin Count 160 160
Manufacturer Package Code SOT802-1 SOT-802-2
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B160 R-PBGA-B160
Length 13 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 2 2
Number of Bits 28 28
Number of Functions 1 1
Number of Terminals 160 160
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 2.15 ns 1.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.15 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 9 mm 9 mm
fmax-Min 270 MHz 550 MHz
Base Number Matches 1 2

Compare SSTU32865ET/G,518 with alternatives

Compare SSTUG32865ET/S with alternatives