SSTU32865ET/G,518
vs
SSTUG32865ET/S
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
9 X 13 MM, 0.80 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, SOT-802-1, TFBGA-160
|
9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160
|
Pin Count |
160
|
160
|
Manufacturer Package Code |
SOT802-1
|
SOT-802-2
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTU
|
SSTU
|
JESD-30 Code |
R-PBGA-B160
|
R-PBGA-B160
|
Length |
13 mm
|
13 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
2
|
2
|
Number of Bits |
28
|
28
|
Number of Functions |
1
|
1
|
Number of Terminals |
160
|
160
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Propagation Delay (tpd) |
2.15 ns
|
1.4 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.15 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
2 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
9 mm
|
9 mm
|
fmax-Min |
270 MHz
|
550 MHz
|
Base Number Matches |
1
|
2
|
|
|
|
Compare SSTU32865ET/G,518 with alternatives
Compare SSTUG32865ET/S with alternatives