SST39WF400B-70-4C-Y1QE
vs
M29DW641F70ZE6F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
DSBGA
BGA
Package Description
4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, WFBGA-48
TFBGA, BGA48,6X8,32
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
6 mm
8 mm
Memory Density
4194304 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
262144 words
4194304 words
Number of Words Code
256000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.62 mm
1.2 mm
Supply Voltage-Max (Vsup)
1.95 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
4 mm
6 mm
Base Number Matches
2
3
Rohs Code
Additional Feature
100,000 PROGRAM/ERASE CYCLES
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e1
Number of Sectors/Size
16,126
Package Equivalence Code
BGA48,6X8,32
Page Size
8 words
Ready/Busy
YES
Sector Size
4K,32K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Terminal Finish
TIN SILVER COPPER
Toggle Bit
YES
Compare SST39WF400B-70-4C-Y1QE with alternatives
Compare M29DW641F70ZE6F with alternatives