SST39VF801C-70-4I-EKE vs SST39VF800A-70-4I-B3KE feature comparison

SST39VF801C-70-4I-EKE Microchip Technology Inc

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SST39VF800A-70-4I-B3KE Silicon Storage Technology

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SILICON STORAGE TECHNOLOGY INC
Part Package Code TSOP1 BGA
Package Description 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP-48 TFBGA, BGA48,6X8,32
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Factory Lead Time 7 Weeks
Samacsys Manufacturer Microchip
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G48 R-PBGA-B48
JESD-609 Code e3 e1
Length 18.4 mm 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1
Number of Sectors/Size 1,2,1,15 256
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TFBGA
Package Equivalence Code TSSOP48,.8,20 BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 8K,4K,16K,32K 2K
Standby Current-Max 0.00002 A 0.00002 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 12 mm 6 mm
Base Number Matches 1 2

Compare SST39VF801C-70-4I-EKE with alternatives

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