SST39VF801C-70-4I-B3KE
vs
SST39VF800A-70-4I-C1Q
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB1,TFBGA-48
VFBGA, BGA48,6X11,20
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
10 Weeks
Samacsys Manufacturer
Microchip
Access Time-Max
70 ns
70 ns
Additional Feature
BOTTOM BOOT BLOCK
Boot Block
BOTTOM
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
e0
Length
8 mm
6 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
1
Number of Sectors/Size
1,2,1,15
256
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
240
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
0.52 mm
Sector Size
8K,4K,16K,32K
2K
Standby Current-Max
0.00002 A
0.00002 A
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
4 mm
Base Number Matches
1
1
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