SST39VF800A-70-4I-B3KE-T-MCH
vs
SST39VF800A-70-4C-B3KE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Package Description
TFBGA-48
TFBGA, BGA48,6X8,32
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
6 mm
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
BGA
Pin Count
48
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e1
Number of Sectors/Size
256
Package Equivalence Code
BGA48,6X8,32
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Sector Size
2K
Standby Current-Max
0.00002 A
Supply Current-Max
0.03 mA
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
Type
NOR TYPE
Compare SST39VF800A-70-4I-B3KE-T-MCH with alternatives
Compare SST39VF800A-70-4C-B3KE with alternatives