SST39VF6402B-90-4I-B1K vs K8D6316UTMYC0900 feature comparison

SST39VF6402B-90-4I-B1K Microchip Technology Inc

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K8D6316UTMYC0900 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA TSOP1
Package Description 8 X 10 MM, 0.80 MM PITCH, MO-210, TFBGA-48 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Additional Feature TOP BOOT BLOCK
Boot Block TOP TOP
JESD-30 Code R-PBGA-B48 R-PDSO-G48
JESD-609 Code e3 e0
Length 10 mm 18.4 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE NOR TYPE
Width 8 mm 12 mm
Base Number Matches 2 1
Alternate Memory Width 8

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Compare K8D6316UTMYC0900 with alternatives