SST39VF1682-70-4I-B3K vs LH28F160BJE-TTL70 feature comparison

SST39VF1682-70-4I-B3K Microchip Technology Inc

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LH28F160BJE-TTL70 Sharp Corp

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SHARP CORP
Part Package Code BGA
Package Description 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 12 X 20 MM, PLASTIC, TSOP-48
Pin Count 48
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature TOP BOOT BLOCK TOP BOOT BLOCK
Boot Block TOP TOP
JESD-30 Code R-PBGA-B48 R-PDSO-G48
JESD-609 Code e3 e6
Length 8 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN BISMUTH
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE NOR TYPE
Width 6 mm 12 mm
Base Number Matches 3 1
Alternate Memory Width 16
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SST39VF1682-70-4I-B3K with alternatives

Compare LH28F160BJE-TTL70 with alternatives