SST39VF1681-70-4I-B3KE
vs
SST36VF1601G-70-4C-L1PE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
8 X 10 MM, ROHS COMPLIANT, MO-210, LFBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
e1
Length
8 mm
10 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX8
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
8 mm
Base Number Matches
1
1
Alternate Memory Width
8
Boot Block
BOTTOM
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
4,1,31
Package Equivalence Code
BGA56,8X8,32
Ready/Busy
YES
Sector Size
4K,48K,64K
Standby Current-Max
0.00002 A
Supply Current-Max
0.045 mA
Toggle Bit
YES
Type
NOR TYPE
Compare SST39VF1681-70-4I-B3KE with alternatives
Compare SST36VF1601G-70-4C-L1PE with alternatives