SST39VF1681-70-4C-B3K vs SST39VF1661-70-4I-EKE feature comparison

SST39VF1681-70-4C-B3K Silicon Storage Technology

Buy Now Datasheet

SST39VF1661-70-4I-EKE Microchip Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code BGA TSOP1
Package Description 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 12 X 20 MM, MO-142DD, TSOP1-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B48 R-PDSO-G48
Length 8 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE NOR TYPE
Width 6 mm 12 mm
Base Number Matches 2 1
Pbfree Code Yes
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare SST39VF1681-70-4C-B3K with alternatives

Compare SST39VF1661-70-4I-EKE with alternatives