SST39VF040-70-4CNHE
vs
M29F040-90FNM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
THOMSON-CSF SEMICONDUCTORS
|
| Part Package Code |
QFJ
|
|
| Package Description |
QCCJ,
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Access Time-Max |
70 ns
|
90 ns
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| JESD-609 Code |
e3
|
|
| Length |
13.97 mm
|
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
2.7 V
|
5 V
|
| Seated Height-Max |
2.8448 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.43 mm
|
|
| Base Number Matches |
5
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.51
|
| Additional Feature |
|
100,000 PROGRAM/ERASE CYCLES
|
| Qualification Status |
|
Not Qualified
|
| Type |
|
NOR TYPE
|
|
|
|
Compare SST39VF040-70-4CNHE with alternatives
Compare M29F040-90FNM with alternatives