SST39VF010-70-4C-B3K
vs
SST39VF010-70-4C-NHE
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SILICON STORAGE TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
QFJ
|
| Package Description |
TFBGA, BGA48,6X8,32
|
ROHS COMPLIANT, PLASTIC, MO-016AE, LCC-32
|
| Pin Count |
48
|
32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| JESD-30 Code |
R-PBGA-B48
|
R-PQCC-J32
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8 mm
|
13.97 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
32
|
32
|
| Number of Terminals |
48
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
QCCJ
|
| Package Equivalence Code |
BGA48,6X8,32
|
LDCC32,.5X.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
245
|
| Programming Voltage |
2.7 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.8448 mm
|
| Sector Size |
4K
|
4K
|
| Standby Current-Max |
0.000015 A
|
0.000015 A
|
| Supply Current-Max |
0.02 mA
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
6 mm
|
11.43 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Data Retention Time-Min |
|
100
|
| Endurance |
|
100000 Write/Erase Cycles
|
| Moisture Sensitivity Level |
|
3
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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