SST36VF3203-70-4I-EKE vs K8D3216UBCFI0700 feature comparison

SST36VF3203-70-4I-EKE Microchip Technology Inc

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K8D3216UBCFI0700 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1 BGA
Package Description 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 6 X 8.5 MM, 0.80 MM PITCH, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PDSO-G48 R-PBGA-B48
JESD-609 Code e3
Length 18.4 mm 8.5 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL BOTTOM
Type NOR TYPE NOR TYPE
Width 12 mm 6 mm
Base Number Matches 1 1

Compare SST36VF3203-70-4I-EKE with alternatives

Compare K8D3216UBCFI0700 with alternatives