SST36VF1602C-70-4I-EK
vs
AM29LV160MT-70WCK
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
SPANSION INC
Part Package Code
TSOP1
BGA
Package Description
TSOP1, TSSOP48,.8,20
TFBGA,
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
Boot Block
TOP
TOP
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PDSO-G48
R-PBGA-B48
Length
18.4 mm
9 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
4,1,31
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TFBGA
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
4K,48K,64K
Standby Current-Max
0.00002 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
10
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
12 mm
8 mm
Base Number Matches
2
1
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
TIN SILVER COPPER
Compare SST36VF1602C-70-4I-EK with alternatives
Compare AM29LV160MT-70WCK with alternatives