SST34HF3243B-90-4E-LP
vs
MB84VD21081EM-70PBS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
FUJITSU LTD
Part Package Code
BGA
Package Description
LFBGA, BGA56,8X8,32
TFBGA, BGA56,8X8,32
Pin Count
56
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
90 ns
70 ns
Additional Feature
ALSO CONTAINS (512K X 8/ 256K X 16-BIT) SRAM
SRAM IS ORGANIZED AS 128K X 16/256K X 8
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
Length
12 mm
7.2 mm
Memory Density
33554432 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
56
56
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Organization
2MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA56,8X8,32
BGA56,8X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Standby Current-Max
0.00004 A
0.000004 A
Supply Current-Max
0.06 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
7 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare SST34HF3243B-90-4E-LP with alternatives
Compare MB84VD21081EM-70PBS with alternatives