SST34HF3243B-70-4E-LP
vs
MB84VD21181EM-70PBS
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SILICON STORAGE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
LFBGA, BGA56,8X8,32
|
|
Pin Count |
56
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Access Time-Max |
70 ns
|
70 ns
|
Additional Feature |
ALSO CONTAINS (512K X 8/ 256K X 16-BIT) SRAM
|
|
JESD-30 Code |
R-PBGA-B56
|
S-PBGA-B56
|
Length |
12 mm
|
|
Memory Density |
33554432 bit
|
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
|
Mixed Memory Type |
FLASH+SRAM
|
FLASH+SRAM
|
Number of Functions |
1
|
|
Number of Terminals |
56
|
56
|
Number of Words |
2097152 words
|
|
Number of Words Code |
2000000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
Organization |
2MX16
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
FBGA
|
Package Equivalence Code |
BGA56,8X8,32
|
BGA56,8X8,32
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
|
Standby Current-Max |
0.00004 A
|
0.000005 A
|
Supply Current-Max |
0.06 mA
|
0.05 mA
|
Supply Voltage-Max (Vsup) |
3.3 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
|
Base Number Matches |
1
|
4
|
Power Supplies |
|
3 V
|
|
|
|
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