SST34HF1622S-70-4C-L1PE vs SST34HF1622S-70-4C-L1PE feature comparison

SST34HF1622S-70-4C-L1PE Silicon Storage Technology

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SST34HF1622S-70-4C-L1PE Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56
Pin Count 56 56
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 128K X 16 / 256K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 SRAM IS ORGANIZED AS 128K X 16 / 256K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e1 e1
Length 10 mm 10 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code Yes

Compare SST34HF1622S-70-4C-L1PE with alternatives

Compare SST34HF1622S-70-4C-L1PE with alternatives