SST34HF1622S-70-4C-L1PE
vs
SST34HF1602C-70-4C-LSE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56
LFBGA,
Pin Count
56
62
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
SRAM IS ORGANIZED AS 128K X 16 / 256K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8
FLASH CAN ALSO BE ORGANIZED AS 2M X 8
JESD-30 Code
R-PBGA-B56
R-PBGA-B62
JESD-609 Code
e1
e1
Length
10 mm
10 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
56
62
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare SST34HF1622S-70-4C-L1PE with alternatives
Compare SST34HF1602C-70-4C-LSE with alternatives