SST34HF1621-70-4C-LFP vs MB84VD21182EM-70PBS feature comparison

SST34HF1621-70-4C-LFP Silicon Storage Technology

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MB84VD21182EM-70PBS FUJITSU Limited

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC FUJITSU LTD
Part Package Code BGA
Package Description LFBGA, BGA56,8X8,32 TFBGA, BGA56,8X8,32
Pin Count 56
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature ALSO CONTAINS 128K X 16 SRAM SRAM IS ORGANIZED AS 256K X 16/512K X 8
JESD-30 Code R-PBGA-B56 R-PBGA-B56
Length 10 mm 7.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA56,8X8,32 BGA56,8X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Current-Max 0.075 mA 0.05 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 7 mm
Base Number Matches 1 1
Rohs Code No
Access Time-Max 70 ns
JESD-609 Code e0
Standby Current-Max 0.000015 A
Terminal Finish TIN LEAD

Compare SST34HF1621-70-4C-LFP with alternatives

Compare MB84VD21182EM-70PBS with alternatives