SST32HF162C-70-4E-LBK
vs
SST34HF1641C-70-4E-L1P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LFBGA,
Pin Count
48
56
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
STATIC RAM IS ORGANIZED AS 128K X 16
SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8
JESD-30 Code
R-PBGA-B48
R-PBGA-B56
Length
12 mm
10 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
56
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-20 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
8 mm
Base Number Matches
1
1
Rohs Code
Peak Reflow Temperature (Cel)
240
Supply Voltage-Nom (Vsup)
3 V
Time@Peak Reflow Temperature-Max (s)
10
Compare SST32HF162C-70-4E-LBK with alternatives
Compare SST34HF1641C-70-4E-L1P with alternatives