SST29VE512-200-4C-WH vs X28C512DM-15 feature comparison

SST29VE512-200-4C-WH Silicon Storage Technology

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X28C512DM-15 Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code TSOP1
Package Description TSOP1, HERMETIC SEALED, CERDIP-32
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 200 ns 150 ns
JESD-30 Code R-PDSO-G32 R-CDIP-T32
Length 12.4 mm 42.95 mm
Memory Density 524288 bit 524288 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSOP1 DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programming Voltage 3 V 5 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 5.9 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 8 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Factory Lead Time 4 Weeks
Additional Feature LG_MAX
Screening Level MIL-STD-883
Supply Current-Max 0.05 mA

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Compare X28C512DM-15 with alternatives