SST26VF064BA-104I/TD vs SST26VF064B-104I/S70S feature comparison

SST26VF064BA-104I/TD Microchip Technology Inc

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SST26VF064B-104I/S70S Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description TBGA-24 DIE,
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
JESD-30 Code R-PBGA-B24 R-XUUC-N
Length 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 24
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64MX1 64MX1
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TBGA DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE UNCASED CHIP
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Screening Level TS 16949 TS 16949
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL NO LEAD
Terminal Pitch 1 mm
Terminal Position BOTTOM UPPER
Width 6 mm
Base Number Matches 1 1
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
Number of Ports 1
Output Characteristics 3-STATE
Package Equivalence Code DIE OR CHIP
Serial Bus Type SPI
Standby Current-Max 0.000045 A
Supply Current-Max 0.025 mA
Type NOR TYPE
Write Protection HARDWARE

Compare SST26VF064BA-104I/TD with alternatives

Compare SST26VF064B-104I/S70S with alternatives