SST25WF080-75-4I-ZAE-PP028 vs AT24C04D-CUM-T feature comparison

SST25WF080-75-4I-ZAE-PP028 Microchip Technology Inc

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AT24C04D-CUM-T Atmel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ATMEL CORP
Package Description XFBGA-8 VFBGA, BGA8,2X4,40/20
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 1 MHz
Data Retention Time-Min 100 100
Endurance 10000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 Code R-PBGA-B8 R-PBGA-B8
Memory Density 8388608 bit 4096 bit
Memory IC Type FLASH EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 512 words
Number of Words Code 1000000 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 512X8
Output Characteristics 3-STATE
Parallel/Serial SERIAL SERIAL
Programming Voltage 1.8 V
Serial Bus Type SPI I2C
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE HARDWARE
Base Number Matches 1 1
Samacsys Manufacturer Microchip
I2C Control Byte 1010DDXR
Length 2 mm
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA8,2X4,40/20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 0.85 mm
Standby Current-Max 4e-7 A
Supply Current-Max 0.001 mA
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.5 mm
Write Cycle Time-Max (tWC) 5 ms

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