SSM2375CBZ-REEL
vs
MAX9700DEBC-T
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
WLCSP-9
|
1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12
|
| Pin Count |
9
|
12
|
| Manufacturer Package Code |
CB-9-2
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| Gain |
12 dB
|
20 dB
|
| JESD-30 Code |
S-PBGA-B9
|
R-PBGA-B12
|
| JESD-609 Code |
e3
|
e0
|
| Length |
1.46 mm
|
2.02 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
3.2 W
|
1.6 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA9,3X3,20
|
BGA12,3X4,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.655 mm
|
0.67 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
1.46 mm
|
1.54 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Technology |
|
BICMOS
|
|
|
|
Compare SSM2375CBZ-REEL with alternatives
Compare MAX9700DEBC-T with alternatives