SSM2134P
vs
SE5534AFK
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP8,.3
|
HQCCN,
|
Pin Count |
8
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
1.5 µA
|
1.5 µA
|
Bias Current-Max (IIB) @25C |
1.5 µA
|
|
Common-mode Reject Ratio-Min |
70 dB
|
|
Common-mode Reject Ratio-Nom |
114 dB
|
100 dB
|
Frequency Compensation |
YES (AVCL>=3)
|
|
Input Offset Voltage-Max |
2000 µV
|
3000 µV
|
JESD-30 Code |
R-PDIP-T8
|
S-CQCC-N20
|
JESD-609 Code |
e0
|
|
Length |
9.88 mm
|
8.89 mm
|
Low-Offset |
NO
|
|
Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
HQCCN
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
5.33 mm
|
2.03 mm
|
Slew Rate-Nom |
6 V/us
|
13 V/us
|
Supply Current-Max |
6.5 mA
|
|
Supply Voltage Limit-Max |
22 V
|
22 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Unity Gain BW-Nom |
10000
|
10000
|
Voltage Gain-Min |
25000
|
|
Width |
7.62 mm
|
8.89 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare SSM2134P with alternatives
Compare SE5534AFK with alternatives