SPI-8002TW
vs
SPI-8002TW
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SANKEN ELECTRIC CO LTD
|
ALLEGRO MICROSYSTEMS LLC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
HSOP,
|
HSOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
DUAL SWITCHING CONTROLLER
|
DUAL SWITCHING CONTROLLER
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
38 V
|
38 V
|
| Input Voltage-Min |
4.5 V
|
4.5 V
|
| Input Voltage-Nom |
15 V
|
15 V
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
12.2 mm
|
12.2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
135 °C
|
|
| Operating Temperature-Min |
-30 °C
|
|
| Output Current-Max |
1.5 A
|
1.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
HSOP
|
| Package Equivalence Code |
SOP16,.4
|
SOP16,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.75 mm
|
2.75 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
PHASE-SHIFT
|
BUCK
|
| Switching Frequency-Max |
285 kHz
|
285 kHz
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|