SPD6623SMTXV
vs
MSP1N6623US
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
MICROSEMI CORP
|
| Package Description |
O-LELF-R2
|
O-LELF-R2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
METALLURGICALLY BONDED
|
HIGH RELIABILITY
|
| Application |
EFFICIENCY
|
ULTRA FAST RECOVERY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| Non-rep Pk Forward Current-Max |
20 A
|
20 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
1.5 A
|
1 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
800 V
|
800 V
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.06 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Breakdown Voltage-Min |
|
880 V
|
| Forward Voltage-Max (VF) |
|
1.8 V
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-PRF-19500
|
| Reverse Current-Max |
|
0.5 µA
|
| Reverse Test Voltage |
|
800 V
|
| Technology |
|
AVALANCHE
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SPD6623SMTXV with alternatives
Compare MSP1N6623US with alternatives