SPD5817VSMSTXV
vs
SPD5817SMM
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SOLID STATE DEVICES INC
|
SOLID STATE DEVICES INC
|
Package Description |
HERMETIC SEALED, SMS, 2 PIN
|
HERMETIC SEALED PACKAGE-2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.55 V
|
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
Non-rep Pk Forward Current-Max |
25 A
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL
|
|
Rep Pk Reverse Voltage-Max |
20 V
|
20 V
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
1
|
1
|
Operating Temperature-Min |
|
-55 °C
|
|
|
|
Compare SPD5817VSMSTXV with alternatives
Compare SPD5817SMM with alternatives