SPD5817TX vs 1N5817143 feature comparison

SPD5817TX Solid State Devices Inc (SSDI)

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1N5817143 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SOLID STATE DEVICES INC NXP SEMICONDUCTORS
Package Description HERMETIC SEALED PACKAGE-2 O-LALF-W2
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Application GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.55 V
JESD-30 Code O-XALF-W2 O-LALF-W2
Non-rep Pk Forward Current-Max 25 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Output Current-Max 1 A 1 A
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 20 V 20 V
Surface Mount NO NO
Technology SCHOTTKY SCHOTTKY
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 2 1

Compare SPD5817TX with alternatives

Compare 1N5817143 with alternatives