SPC5777CSK3MMO3
vs
SPC5777CCK3MME3
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
MAPBGA-516
|
MAPBGA-416
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
5A992.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
|
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B416
|
| Length |
27 mm
|
27 mm
|
| Number of Terminals |
516
|
416
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| RAM (bytes) |
524288
|
524288
|
| ROM (words) |
8388608
|
8388608
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.02 mm
|
2.02 mm
|
| Speed |
264 MHz
|
264 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
12 Weeks
|
| Date Of Intro |
|
2016-03-08
|
| CPU Family |
|
E200Z7
|
| Format |
|
FLOATING-POINT
|
| Integrated Cache |
|
YES
|
| JESD-609 Code |
|
e2
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of DMA Channels |
|
128
|
| Number of External Interrupts |
|
1
|
| Number of Serial I/Os |
|
5
|
| Number of Timers |
|
|
| On Chip Data RAM Width |
|
8
|
| Package Equivalence Code |
|
BGA416,26X26,40
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
1350 mA
|
| Terminal Finish |
|
Tin/Silver (Sn/Ag)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare SPC5777CSK3MMO3 with alternatives
Compare SPC5777CCK3MME3 with alternatives