SPC5607BF1MLU6
vs
SPC5607BF1MLU6
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
,
|
|
Pin Count |
176
|
176
|
Reach Compliance Code |
unknown
|
compliant
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Samacsys Manufacturer |
|
NXP
|
Bit Size |
|
32
|
JESD-30 Code |
|
S-PQFP-G176
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Number of Terminals |
|
176
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
QFP
|
Package Equivalence Code |
|
QFP176,1.0SQ,20
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
98304
|
ROM (words) |
|
1572864
|
ROM Programmability |
|
FLASH
|
Screening Level |
|
AEC-Q100
|
Speed |
|
64 MHz
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
Matte Tin (Sn)
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|