SPC5200CBV400BR2
vs
SPC5200CVR466BR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272
BGA, BGA272,20X20,50
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.A.2
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
35 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
2.65 mm
2.65 mm
Speed
400 MHz
466 MHz
Supply Voltage-Max
1.58 V
1.58 V
Supply Voltage-Min
1.42 V
1.42 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
272
Compare SPC5200CBV400BR2 with alternatives
Compare SPC5200CVR466BR2 with alternatives