SPAKMC332GMPV16
vs
SPAKMC332GCFV20
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC, QFP-132
20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
NO
CPU Family
68000
68000
Clock Frequency-Max
16 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G132
S-PQFP-G144
Length
20 mm
20 mm
Moisture Sensitivity Level
1
Number of I/O Lines
31
24
Number of Terminals
132
144
On Chip Program ROM Width
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Equivalence Code
QFP144,.87SQ,20
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
2048
2048
ROM (words)
32768
ROM Programmability
EEPROM
Seated Height-Max
1.6 mm
1.6 mm
Speed
16 MHz
20 MHz
Supply Current-Max
134 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
HCMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
4
4
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SPAKMC332GMPV16 with alternatives
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