SP8853BHC
vs
SP8853/B/HC
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
MICROSEMI CORP
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
4-BIT AUXILIARY INPUT COUNTER
|
|
Analog IC - Other Type |
PLL FREQUENCY SYNTHESIZER
|
|
JESD-30 Code |
S-PQCC-J28
|
S-XQCC-J28
|
JESD-609 Code |
e0
|
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Supplies |
5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max (Isup) |
40 mA
|
40 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
|
Supply Voltage-Min (Vsup) |
4.75 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
3
|
Part Package Code |
|
QFN
|
Package Description |
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
|
28
|
HTS Code |
|
8542.39.00.01
|
|
|
|
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