SP8853/AC/DG vs SP8853ACHC feature comparison

SP8853/AC/DG Zarlink Semiconductor Inc

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SP8853ACHC Dynex Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC GEC PLESSEY SEMICONDUCTORS
Package Description CERAMIC, DIL-28 QCCJ, LDCC28,.5SQ
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Additional Feature DUAL MODULUS PRESCALER : 8/9, 16/17 4-BIT AUXILIARY INPUT COUNTER
Analog IC - Other Type PLL FREQUENCY SYNTHESIZER PLL FREQUENCY SYNTHESIZER
JESD-30 Code R-GDIP-T28 S-PQCC-J28
JESD-609 Code e0 e0
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP28,.6 LDCC28,.5SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.59 mm
Supply Current-Max (Isup) 40 mA 40 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm
Base Number Matches 4 2
Power Supplies 5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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