SP800LEP
vs
ADM8691ARN-REEL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SIPEX CORP
|
ANALOG DEVICES INC
|
| Package Description |
PLASTIC, MS-001BB, DIP-16
|
MS-012AC, SOIC-16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Additional Feature |
BAT BUP SW:Y;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.05 mm
|
9.9 mm
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.334 mm
|
1.75 mm
|
| Supply Current-Max (Isup) |
0.06 mA
|
0.2 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
4.75 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+4.65V
|
+4.65V
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Technology |
|
CMOS
|
|
|
|
Compare SP800LEP with alternatives
Compare ADM8691ARN-REEL with alternatives