SP2002BAC vs SP8853AHC feature comparison

SP2002BAC Zarlink Semiconductor Inc

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SP8853AHC Dynex Semiconductor

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC GEC PLESSEY SEMICONDUCTORS
Package Description PGA, PGA68,11X11
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code S-XPGA-P68 S-PQCC-J28
JESD-609 Code e0 e0
Neg Supply Voltage-Nom (Vsup) -4.5 V
Number of Terminals 68 28
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code PGA QCCJ
Package Equivalence Code PGA68,11X11 LDCC28,.5SQ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY CHIP CARRIER
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Current-Max (Isup) 1350 mA 40 mA
Surface Mount NO YES
Technology ECL BIPOLAR
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Base Number Matches 3 1
Additional Feature 4-BIT AUXILIARY INPUT COUNTER
Analog IC - Other Type PLL FREQUENCY SYNTHESIZER
Number of Functions 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Power Supplies 5 V
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Temperature Grade MILITARY
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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