SP2002BAC vs SP8853/A/DG feature comparison

SP2002BAC Zarlink Semiconductor Inc

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SP8853/A/DG Zarlink Semiconductor Inc

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC ZARLINK SEMICONDUCTOR INC
Package Description PGA, PGA68,11X11 CERAMIC, DIL-28
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-XPGA-P68 R-GDIP-T28
JESD-609 Code e0 e0
Neg Supply Voltage-Nom (Vsup) -4.5 V
Number of Terminals 68 28
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code PGA DIP
Package Equivalence Code PGA68,11X11 DIP28,.6
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY IN-LINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Supply Current-Max (Isup) 1350 mA 40 mA
Surface Mount NO NO
Technology ECL BIPOLAR
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR DUAL
Base Number Matches 3 4
Additional Feature DUAL MODULUS PRESCALER : 8/9, 16/17
Analog IC - Other Type PLL FREQUENCY SYNTHESIZER
Number of Functions 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Seated Height-Max 5.59 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Temperature Grade INDUSTRIAL
Width 15.24 mm

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