SP2002BAC
vs
SP8853/A/DG
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
ZARLINK SEMICONDUCTOR INC
|
Package Description |
PGA, PGA68,11X11
|
CERAMIC, DIL-28
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XPGA-P68
|
R-GDIP-T28
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage-Nom (Vsup) |
-4.5 V
|
|
Number of Terminals |
68
|
28
|
Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
Package Code |
PGA
|
DIP
|
Package Equivalence Code |
PGA68,11X11
|
DIP28,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max (Isup) |
1350 mA
|
40 mA
|
Surface Mount |
NO
|
NO
|
Technology |
ECL
|
BIPOLAR
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
DUAL
|
Base Number Matches |
3
|
4
|
Additional Feature |
|
DUAL MODULUS PRESCALER : 8/9, 16/17
|
Analog IC - Other Type |
|
PLL FREQUENCY SYNTHESIZER
|
Number of Functions |
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Seated Height-Max |
|
5.59 mm
|
Supply Voltage-Max (Vsup) |
|
5.25 V
|
Supply Voltage-Min (Vsup) |
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Temperature Grade |
|
INDUSTRIAL
|
Width |
|
15.24 mm
|
|
|
|
Compare SP8853/A/DG with alternatives