SNJ54LS399J
vs
54LS399/BEAJC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
FOUR 2:1 MUX FOLLOWED BY REGISTER
Family
LS
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Length
19.56 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
32 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
2
3
JESD-609 Code
e0
Max I(ol)
0.004 A
Number of Inputs
2
Package Equivalence Code
DIP16,.3
Power Supplies
5 V
Power Supply Current-Max (ICC)
13 mA
Prop. Delay@Nom-Sup
45 ns
Terminal Finish
Tin/Lead (Sn/Pb)
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