SN74SSTVF32852KR vs V62/08602-01XA feature comparison

SN74SSTVF32852KR Texas Instruments

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V62/08602-01XA Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-114 LFBGA, BGA114,6X19,32
Pin Count 114 114
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code R-PBGA-B114 R-PBGA-B114
JESD-609 Code e0 e0
Length 16 mm 15.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 500000000 Hz
Max I(ol) 0.008 A
Moisture Sensitivity Level 3 3
Number of Bits 24 1
Number of Functions 1 1
Number of Terminals 114 114
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA114,6X19,32 BGA114,6X19,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 220 220
Prop. Delay@Nom-Sup 2.6 ns
Propagation Delay (tpd) 2.6 ns 3.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 500 MHz 200 MHz
Base Number Matches 1 1

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